Silica is poised to move into new market territories following its franchise distribution agreement with Huawei, a supplier of multi-standard 3G and 4G wireless modules.
“This agreement broadens our portfolio, fills a technology gap and is complementary to our existing suppliers,” says Laurence Dellicott, Silica’s technical director. “It future proofs us as we penetrate deeper into the Internet of Things and Industry 4.0 markets.”
Silica’s team has already undergone intensive training on the new products.
The agreement sees Silica marketing multi-standard 3G and 4G wireless modules in a choice of popular form factors, including LGA, PCIe and PCI-SIG M.2. Based on Huawei HiSilicon chipset technology, the new modules offer features specific for M2M communication.
“We will supply in-depth technical support and is providing software support out of the box for HUAWEI modules for their ArchiTech evaluation boards, accelerating and facilitating the product development,” adds Dellicott.
The boards also feature mini PCIe connectors and SIM cardholders.
Georg Steimel, head of M2M Solutions, HUAWEI,comments, “We are very glad to have found an experienced franchise partner with SILICA that will enable us to significantly leverage the marketing of our products. Its outstanding expertise in the industry and in-depth support make SILICA an ideal partner. The partnership with the agile and market leading player will accelerate our growth significantly and in combination with our innovative technology will help to gain the leadership in this market.”


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