High-speed modular mezzanine connectors enhance design flexibility for parallel board assembly
Electronic components distributor Digi-Key Corporation, recognized by design engineers as having the industry’s broadest selection of electronic components available for immediate shipment, today announced it has stock on Hirose Electric’s IT3 Series of high-speed modular mezzanine connectors.
These connectors are now available for purchase on Digi-Key’s global websites and will be featured in future print and online catalogs.
Providing network and telecommunications design engineers an advanced modular connection system that delivers high-speed performances with a more flexible and reliable method of assembly, the IT3 Series connector system represents advancement over two-piece mezzanine connector designs by providing two board-mounted receptacles of the same low profile and a variable height interposer to accommodate different board spacing requirements.
Hirose’s IT3 Mezzanine Connector system features a three-piece modular design consisting of two low profile receptacles mounted to each parallel PC board with BGA solder balls mounted in a staggering array of 1.5mm by 1.75mm pitch. The floating interposer module connects the two mounted receptacles and reduces the possibility of mechanical damage to the BGA joints. Compatible with industry standard footprints, the IT3 Series connector system is currently available in 100-, 200-, and 300-position modules with interposers for board stack heights from 15mm to 40mm.
The IT3 Series connectors are rated at 50 ohm single ended impedance and 100 ohm differential impedance. BGA solder balls are available in standard eutectic tin-lead (Sn63-Pb37) or lead-free (Sn-Ag3.0-Cu0.5). IT3 Series connectors are qualified to EIA-364-1000 for environmental performance and IPC-9701 for long-term joint reliability.