At the embedded world 2013 in Hall 2 on Stand 2-219, MSC is presenting a dual-mode SPP/BLE module just 15.6 x 8.7 x 1.8 mm3 in size that combines the SPP functionality required for classical Bluetooth 2.1 applications with a variety of Bluetooth 4.0 low-energy functions.
The Panasonic PAN 1026 module, based on Toshiba’s TC35661 Bluetooth single chip and fitted with an integrated ceramic antenna, features a power output of +4 dBm, which is unusually high for dual-mode Bluetooth modules and an equally very high reception sensitivity of -87 dBm. The power requirement is, however, extremely low, dropping to below 100 µA in sleep mode. In addition, the PAN1026 offers fast data transfer via Bluetooth V3.0 including wireless LAN co-existence.
The module’s software was developed by Toshiba. The stack in the flash for the Toshiba IC supports both SPP (Serial Profile Port) embedded functions and embedded GATT or other Bluetooth LE profiles on the module. Simple and quick integration into the target application is also guaranteed by the complete CE, FCC and Bluetooth qualification of the module.
The broad operating temperature range of – 40 to + 85 °C and its compact form positively predestine the PAN1026 for sophisticated embedded applications in the target markets of industrial automation, medical technology and automotive.
For evaluation purposes, a complete PAN 1026 development kit is available from MSC which contains comprehensive documentation such as application notes, approvals and test reports in addition to two USB stick-based reference designs.
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