The RTC-700 from AAEON is a new powerful slim rugged tablet computer ideal for applications in harsh/severe environments. This tablet computer is sealed to IP-65 specifications, and is built from the ground up to withstand water, dust, vibration and drops.

The RTC-700 features a sunlight readable 7″ WSVGA (1024 x 600) or a 7″ WXVGA (1280 x 800) display with a projected capacitive multi-touch, 400 nits brightness and a 178° wide viewing angle. Li-Polymer high capacity batteries can provide up to 6 hrs. working time.

The RTC-700R is based on the NVIDIA® Tegra™ 2, 1.0 GHz dual core processor with 1GB DDR2 system memory and 16GB eMMC flash memory and supports Android™ v3.2. The RTC-700T supports Windows™ 7 and is based on the Intel® Atom™ Z670 processor with 1GB DDR2 and 16GB mSATA SSD.

The units offer flexible I/Os such as mini USB, mini HDMI, a micro SD card slot, a SIM card slot, RS-232 (optional), and a DC-IN jack. A carry bag and vehicle DC/DC adapter are optional available accessories.

For communication the RTC-700 uses a wireless LAN IEEE 802.11 b/g/n plus Bluetooth 2.1 EDR and can be upgraded with a 3G modem module. Furthermore both versions feature a 5M pixel camera, a built-in speaker and microphone, GPS navigation, G-sensor, light sensor and a 3-axis digital gyroscope (R-version only). The RTC-700 tablet PC is compliant to CE/FCC class B/UL EMC/safety standards and can operate between -20°C to +60°C.

For pricing information contact Texim Europe

Features
• NVIDIA® Tegra™ 2 1.0 GHz Dual Core (RTC-700R)
• Intel® Atom™ Z670 processor (RTC-700T)
• DDR2 1GB SDRAM
• 7″ TFT LCD display
• PCT multi-touch panel
• Li-Polymer high-capacity battery, 6 hours battery life
• Water and dust proof, IP-65 compliance
• Micro SD card slot, 5M pixel camera
• WLAN 802.11 b/g/n , Bluetooth 2.1 EDR
• G Sensor, light sensor, E-compass, GPS navigation
• Android™ v3.2 or Windows® 7 OS

Contact Texim Europe

element14 partners with Raspberry Pi co-founder Eben Upton and modding guru Ben Heck, to highlight the impact of technology on education, makers and innovation at Maker Faire® Bay Area on May 19 – 20 at the San Mateo County Event Center. Leading up to and throughout Maker Faire, makers across the globe are also invited to join the community discussion online at element14 to follow the activities from afar.

“We’re massive fans of Maker Faire; it’s great to see something like this that unites hackers, programmers and developers from different backgrounds. This is a place where you can come for a day’s fun and find yourself educated and inspired, and meet like minds,” said Raspberry Pi co-founder Eben Upton. “It’s great for Raspberry Pi to have a chance to partner with our friends at element14 at this year’s Maker Faire; we’re really looking forward to the discussions and the community’s exchange of ideas. This opportunity to meet people from the maker movement, learn about their projects, and share ideas is what pushes us to create and shape new technology and contexts.”

To help drive collaboration and technology innovation, Raspberry Pi distributor element14, master modder Ben Heck, and Raspberry Pi co-founder Upton will lead several activities during Maker Faire:

• “How a $35 Computer Will Give Students an Appetite for (STEM)” Panel Discussion: Prominent computing minds and educational leaders, including Ben Heck, Eben Upton and Make’s Matt Richardson will team up on May 19 at 1p.m. on the Make Center Stage to discuss the new credit-card sized Raspberry Pi computer and its potential to transform (STEM) – Science, Technology, Engineering and Math – in the classroom and foster a new generation of savvy programmers.

• “Raspberry Pi Founder Offers Tips for Programming Super Computer” Demo: Upton will showcase how simple it is to program the affordable computer on May 20 from 11 – 11:20 a.m. on the Make Demo Stage. Attendees to gain valuable insight into the development of the board and its influence on the future of technological innovation.
• “Ben Heck Talks Modding with Makers” Demo: Heck will appear on the Make Demo Stage on May 20 at 5 p.m. to give makers a first-hand look at the art of modding by deconstructing a new version of a 3D printer build featured on element14’s “The Ben Heck Show.” Audience participation and collaboration ideas are encouraged and attendees and fans can also register at element14 to win one of Ben’s builds.

• Join the Discussion: Enthusiasts and technology advocates worldwide can also follow element14 on Twitter for live updates from Maker Faire.
“As a committed supporter of the maker movement and the STEM initiative, we’re pleased to partner with Ben and Eben to bring their expertise and love of innovation to Maker Faire,” said Dianne Kibbey, global head of community, element14.

» Contact details for Farnell

The SIM68 from SIMCom is a compact 32-channel GNSS module in SMT package intended for a broad range of OEM applications. The STA8088FG engine integrated in the SIM68 together with the 32 tracking and 2 fast acquisition channels helps to achieve fast time to first fix and improved -148dBm cold start sensitivity. The superior cold start sensitivity allows the SIM68 to acquire, track, and get position fix autonomously in difficult weak signal environment. The receiver’s -162dBm tracking sensitivity allows continuous position coverage in nearly all application environments.

The receiver is optimized for applications requiring high performance, low power, and low cost; suitable for a wide range of OEM configurations including mobile phone, PND, asset tracking, and vehicle navigation products. The metal RF shielding provides protection and allows standard surface mount device pick-and-place process in fully-automated assembly process; enabling high-volume, very cost-efficient production.

SIMCom offers an SIM68 evaluation kit, with an USB V2.0 full speed interface, that allows you to test, try and build your first prototype. For more data, price and delivery contact Texim Europe

Features
• Small footprint: 15 x 13 x 2.4mm, 34-pin LCC package
• 32 tracking & 2 fast acquisition channels
• Compatible with GPS,Galileo and Glonass systems
• High sensitivity:
Tracking: -162dBm
Navigation: -160dBm
Cold start: -148dBm
• Fast TTFF 1s in hot start, 35s in cold start
• High accuracy of 1.5m CEP
• Power consumption: 330mW acquisition, 214mW tracking
• Single 3.3V supply operation
• Operating temperature -40 to +85°C
• Rich set of interfaces:

Applications
• Mobile phone
• Personal navigation devices
• Asset tracking
• Vehicle navigation

Contact Texim Europe

Foremost Electronics, the Essex based specialist distributor of electromechanical components, announces the availability of two new compact and lightweight families of waterproof snap-in connectors from Binder. The 720 series of miniature connectors and the 620 sub-miniature series offer the same key features to designers.

These two new connector families feature a unique snap-in lock offering fast and convenient mating even in areas of restricted access with reliability greater than 500 mating cycles. Two sizes accommodate 3 to 12 contacts with the flexibility of male or female options in both connectors and sockets. Internal elastomeric seals mean the range is dust and waterproof to IP67 with excellent electrical characteristics of up to 7A and 250V.

The simple low-cost all plastic modular design uses high quality materials throughout with polyamide housings, polyurethane moulded cables and gold plated contacts, brass pins and phosphor bronze sockets. Designers are offered many versatile options including adaptors for flush mounting, colour coded versions, sockets with solder and dip-solder contacts.
Alan Cook, Managing Director of Foremost Electronics comments, “These two new connector families from Binder offer the perfect balance of price performance. Their feature set leads the market and we really think they make the perfect connector. We are happy to provide a free sample to any customer who wishes to put them to the test.”

The Kontron PC/104-Plus™ single board computer (SBC) MICROSPACE® MSM-eO offers OEMs the most powerful embedded graphics currently available for PC/104-based SBCs. With long-term availability, this SBC is based on the accelerated processing units of the AMD Embedded G-Series, which, along with a 64-bit CPU, also integrates a programmable graphics unit and a DDR3 memory controller.

The Kontron PC/104-Plus™ SBC MICROSPACE® MSM-eO integrates the single-core AMD T44R processor with 1.2 GHz together with an AMD Radeon HD6250 graphics unit. It supports the latest 3D graphics libraries such as OpenGL 3.2 and DirectX11. It is also ideally suited as an upgrade for existing PC/104-Plus designs that need more graphics performance with low power consumption.

Additionally, the integrated unified video encoder takes the load off the processor when displaying high-resolution videos (1080i/p) making the MICROSPACE® MSM-eO ideal for extremely compact multimedia applications.

With the support of DirectCompute and OpenCL 1.1, OEMs can also implement GPGPU applications with the MICROSPACE® MSM-eO in the low-power segment, using the computing power of the graphics unit for parallel data processing. For more information contact Texim Europe

Features
• Most powerful graphics for long-term available PC/104-Plus™
• AMD™ T44R 1.2GHz single core CPU
• AMD™ FCH A55E chipset
• Up to 4GB DDR3 SO-DIMM RAM
• AMD Radeon™ HD6250 graphics
• 3D performance: 10x D510 (3DMark06)
• CRT: up to 1920×1200 30bpp LCD: up to 1920×1200 24bpp
• Operating temperature: 0°C to +60°C (standard), -40°C to +80°C (optional)

Applications
• Mobile infotainment systems
• Vending machines
• Mobile battery-operated systems

Contact Texim Europe

Lane Electronics has made available the Binder 423 Series of circular connectors designed for severe industrial and commercial applications. Lane Electronics is a franchised distributor for Binder in the United Kingdom.

These are rugged, high performance M16 connectors with excellent 360º EMI shielding and IP67 rating and, according to Lane Electronics, will suit designers looking to specify a circular connector for tough environments in any situation.

Incorporating rugged metal shells, the Binder 423 Series features straight or right angle cable connectors with internal strain relief. To improve applications flexibility, the right angle connectors are adjustable in four radial positions.

Users can specify Binder 423 Series connectors with 2 to 24 gold or silver plated contacts.

Lane is an ideal source for all key connector types including circular, filtered, RF, coaxial, sub – miniature, backshells and adaptors, D connectors, aerospace, test & measurement, IDC, PCB connectors, edge connectors and connectors for rack and panel applications.

Extending its portfolio of embedded Wi-Fi modules, Alpha Micro Components today announced the introduction of its Gainspan GS1011MIPS and GS1011MExS, two of the smallest modules on the market. At just 19.4 mm x 28.7 mm, the new modules provide a significant reduction in footprint and offer an easy to integrate, compact and cost-effective solution for any power critical cost sensitive wireless application in the emerging Internet of Things arena.

Despite the small form factor, the GS1011MIPS and GS1011MExS offer complete 802.11b ultra low power Wi-Fi client or AP solutions. The GS1011MIPS provides low power Wi-Fi connectivity with +8dBm of transmit output power, while the GS1011MExS is an extended range solution offering best in class transmit power of +18dBm.

The GS1011MIPS and GS1011MExS offer easy system integration and minimal use of host resources. The modules provide both UART and SPI interfaces, making it possible to connect to any 8/16/32 bit microcontroller using simple AT commands. The modules are pre-loaded with serial to Wi-Fi firmware with complete Wi-Fi functionality including security, WPS and provisioning features running on the module as well as the networking stack, an embedded HTTP server with network configuration pages, and limited AP capability for ease of provisioning.

The modules feature built-in trace or external antenna options through a U.FL connector, an industrial operating temperature range from -40 to 85 degrees Celsius, and are certified or pre-certified for all major regulatory requirements including FCC, IC and ETSI.

The size-optimized GS1011MIPS and GS1011MExS are the newest additions to Alpha Micro’s portfolio of Wi-Fi modules which include the soldered down GS1500M (802.11b/g/n) and ultra-low power GS1011M (802.11b), as well as the connectorized GS1011MIC.

“These ultra low power small form factor modules from Gainspan really do give developers the option of adding Wi-Fi connectivity, which is an incredibly ubiquitous standard, onto products traditionally targeted for ZigBee or Bluetooth. The interoperability of the 802.11 standard makes this a compelling alternative. We are seeing a host of HAN (Home Area Networks), telecare, and body worn tracking units now adopting this technology”, said Maxine Hewitt, Marketing Director, Alpha Micro Components. GainSpan’s expanding portfolio of modules, with the drivers to support various microcontrollers, and software solutions, is playing a critical role in helping device manufacturers get products to market quickly.”

» Contact details for Alpha Micro

Acal BFi is pleased to announce that it has been selected to join the TeliaSonera Global M2M Services Partnership Program. Under the partnership program, Acal BFi will provide hardware and product solutions for applications in the fast growing Nordic and Baltic wireless machine to machine (M2M) market place, throughout Norway, Sweden, Finland and Denmark.

M2M enables the connection, monitoring and control of remote devices across a wide range of industrial and commercial applications. This technology is growing at double digit rates throughout Europe.

The TeliaSonera Global M2M Partnership Program provides solutions, expertise, products and services in the M2M industry. Each member of the partnership program has a unique role and expertise that together enables the execution of M2M solutions.

Acal BFI supplies specialist electronic and photonic products and is a leading supplier of wireless technology for industrial applications in the Nordic region. It will provide access to wireless products that will enable customers to adopt M2M technology into products for their end markets.

Stefan Lof, Managing Director of Acal BFi in the Nordic region stated: ”The continuing growth of the M2M market is driven by the increasing range of industrial and commercial applications that benefit from wireless control and monitoring. TeliaSonera are the leading mobile network provider in the Nordic and Baltic region and we are delighted to be partnering with them to provide customers access to these key technologies.”

Hans Dahlberg, Head of TeliaSonera Global M2M Services, added: ” We are delighted that Acal BFi has joined the M2M Partnership Program. Their experience and range of products used in wireless technology applications will be a great addition to the M2M ecosystem and of benefit to companies looking to adopt M2M technology.”

Contact Acal

Luso Electronics Distribution today announced availability of a series of highly compact AC-DC switching power supplies that deliver up to 260W of power and eliminate the fans and fan controllers required to cool conventional power supplies, thereby saving cost and freeing up valuable component space. Removing fans and related components and circuitry is also a significant advantage in increasing MTBF and reducing noise in end products.

Manufactured by N2Power, the 260W power supply is essentially the ‘Convection Cooling Option’ from the company’s XL375 series of highly compact AC-DC switching power supplies, which is suitable for a myriad of applications including as industrial automation, telecommunications, gaming systems, security and surveillance systems, and network servers.

The Convection Cooling Option power delivers 260W across all output voltages –eight models are available in the family featuring output voltages from 12V to 56V. “These power supplies deliver high flexibility in power system design,” said David Zelkha, managing director of Luso Electronics. “Engineering teams can design in both convection- and fan-cooled power supplies that use the same very compact and low-profile 3.3 x 5 x 1.5in packaging, connectors and layout, saving both time and cost.” The power supply’s very low profile packaging means it is also ideally suited to 1U product designs.

All models in the series offer Active Current Sharing to allow up to four supplies to be operated in parallel for high-output applications. The Active OR-ing Mosfet Board option is available for N+1 applications. Both 5V standby and 12V auxiliary outputs can be wired OR-able when the main output is disabled. In addition, synchronous rectification delivers exceptionally high efficiency of up to 93% in some models.

N2Power supplies meet a full range of international agency requirements, including RoHS, UL, DEMKO, CE Mark and FCC Class B.

Lane Electronics, one of the UK’s leading suppliers of electrical and electronic connector products, has made available the Binder 423 Series of circular connectors designed for severe industrial and commercial applications. Lane Electronics is a franchised distributor for Binder in the United Kingdom.

These are rugged, high performance M16 connectors with excellent 360º EMI shielding and IP67 rating and, according to Lane Electronics, will suit designers looking to specify a circular connector for tough environments in any situation.

Incorporating rugged metal shells, the Binder 423 Series features straight or right angle cable connectors with internal strain relief. To improve applications flexibility, the right angle connectors are adjustable in four radial positions.

Users can specify Binder 423 Series connectors with 2 to 24 gold or silver plated contacts.

Lane is an ideal source for all key connector types including circular, filtered, RF, coaxial, sub – miniature, backshells and adaptors, D connectors, aerospace, test & measurement, IDC, PCB connectors, edge connectors and connectors for rack and panel applications.